– Overview of Intel Packaging Solutions
– Intel Announces Glass Substrates
– Details on Glass Substrates and Intel’s Ambition to Lead
– Why It’s Significant

This research report analyzes the upcoming transition from FinFET to gate-all-around (GAA) transistor architecture and the significant implications for semiconductor manufacturing equipment and processes. Key findings include: – GAA represents the biggest change in logic chip design since the introduction of 3D FinFET transistors in 2010. – GAA transistors overcome limitations of FinFETs by providing…